Wafer Dicing Systems and Dicing Blades
SMS Associates Pvt. Ltd. is specialized in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC).
SMS Associates Pvt. Ltd. offers dicing equipment with a variety of capabilities, configurations and levels of automation, as well as peripheral instrumentation and accessories, to suit an ever-growing range of customer requirements. Combining our equipment, dicing blades and process know-how we bring our customers comprehensive dicing solutions.
