MAT DIE BONDERS
MAT DIE BONDERS
Performs MCM, Flip Chip, Eutectic, Silver Glass, Ag Sintering etc die attach applications.
Small footprint, Table-Top configuration.
Versatile and User Friendly machine using the same advanced software of Model 6400 running under Windows® on a PC platform.
Fully automatic and Semi-automatic process
allowing highest flexibility and easy operation.
Very High Accuracy closed loop servo systems
control the main motion axes.
High resolution Digital Vision and Image
Processing system.
Time-Pressure or Volumetric Dispenser for
applying complex shapes of adhesive.
Double Dispenser for two different adhesives.
Stamping (Pin Transfer) 75 μm adhesive dots.
Die Presentation:
- Up to 10 Waffle/Gel packs 2”.
- Up to 8 Tape & Reel feeders.
- Future option: one 8” Wafer, Manual Indexing.
- Combinations of the above.
Unique one-pass, wet Die Stacking capability with
BLT control of the dice.
Capability to handle MEMS devices.
Experience with very large Imaging Devices.
Flip Chip process including chip flipping, bump
fluxing and final alignment over a high resolution
Up Looking Camera.
Eutectic MCM processes based on heated
substrates with gas cover and heated pickup tools
with provision of forming gas.
Ultrasonic bond head available for Gold to Gold
Interconnection.
Specification Highlights
Work Area: up to 6” x 6”.Die size range: 0.006” to over 2” Die Material: GaAs, Si, Glass, etc. Substrates: Lead Frames, Ceramic, Silicon Wafers, PCB’s, Metal, TO cans, etc. Pickup/Bond Force: 40 to 9,000 grams.
Placement Accuracy: better than ±3 μm -application dependent.
Throughput: up to 700 CPH – applicationdependent.
Size: 0.97 x 0.85 x 0.65 meter.Weight: under 200 Kg.
Phone 972-4-959-2225 • Fax 972-4-959-2226 • Web site www.mat-ltd.com
