WAFER DICING SYSTEMS

WAFER DICING SYSTEMS AND DICING BLADES

Wafer Dicing Systems and Dicing Blades

WAFER DICING SYSTEMS

ADT is specialized in the development and manufacturing of systems, blades and processes used in the dicing of silicon-based ICs, Package Singulation and hard material Microelectronic Components (MEC).

ADT offers dicing equipment with a variety of capabilities, configurations and levels of automation, as well as peripheral instrumentation and accessories, to suit an ever-growing range of customer requirements. Combining our equipment, dicing blades and process know-how we bring our customers comprehensive dicing solutions.